Low temperature adhesive
  • Research Associate, University of California
Research fields
  • Biochemistry
Personal information

Education

Master

Lab information

DeepMaterial DM-6180 low temperature curing adhesive, fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require low-temperature curing. It can quickly provide customers with high-throughput applications, such as attaching light diffusion lenses to LEDs, and assembling image sensing equipment (including camera modules). This material is white to provide greater reflectivity. Website: https://www.uvadhesiveglue.com/low-temperature/
https://www.uvadhesiveglue.com/low-temperature/

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